| PART |
Description |
Maker |
| HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
| LCM-S01602DSR-A LCM-S01602DSRA |
5.56mm CHARACTER HEIGHT, 5x8 DOT MATRIX, 16x2 LCD MODULE
5.56MM CHARACTER HEIGHT 5 X8 DOT MATRIX
|
LUMEX INC.
|
| RT240128ASR RT240128ASRL |
1/64Duty 1/9 Bias Gray mode STN Transflective
|
List of Unclassifed Manufacturers
ETC
|
| BO6464A |
FSTN Transflective LCD, COG package Built-in driver PCF8548, serial I2C data bus
|
BOLYMIN[Bolymin, Inc]
|
| DMF-50202NY-LY |
128 x 64dots; 0.40 x 0.56mm; 0.3-7.0V 1.0mA LCD module
|
Optrex Corporation
|
| LCM-H01601DSR |
6.56mm CHAR, HEIGHT, 5x8 dot MATRIX, 16x1 LCD MODULE
|
LUMEX INC.
|
| 0440671003 44067-1003 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| WH2002L WH2002L-PYB-CP WH2002L-YYH-CP WH2002L-AYB- |
WH2002L
LCD Character Display Modules Yl/Grn Transflective Yl/Grn LED Backlight
|
List of Unclassifed Manufacturers
ETC
Microtips Technology, Inc.
|
| 44067-0603 0440670603 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-0201 0440670201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
